How critical is IC package lead coplanarity? |
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Answer: Coplanarity is important but it is not a “show stopper. Several lead conditioning options within the technology are available; the process using laser drill feature access should accommodate any small variation in lead heights. Note that all the conventional solder-joint problems encountered in conventional SMT processing (placement, solder-gap, tomb-stoning, pad-land match, registration, starving / excess solder, voiding, cold/disturbed, etc), are non-existent in the improved technology. |
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