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Are materials available that are suitable for encapsulation? Have any materials been qualified?

Answer: Yes. Several off-the shelf materials appear suitable. Requirements for encapsulants include dimensional stability, resist excessive shrinkage resistance, good insulation, low moisture uptake and outgassing, and having a CTE approximating the CTE of common components (e.g., copper ~18ppm/°C), plus all the appropriate mechanical properties. Material developers have a good heritage of producing such products. It is anticipated that this target property balance will be feasible. Qualification depends on the application, but coatings and potting materials tailored for successful harsh MIL-aero and under-the-hood applications have been available for years. No problems are anticipated in finding and demonstrating suitable solutions.