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Can the technology deal with misregistration, at placement and then during encapsulation should it occur?

Answer: Yes. This is important. It is true that the familiar molten-film self-centering effect will not exist with the proposed process. As with conventional SMT processing, initial placement errors and damaged leads will be one of the improved technology’s processing challenges. It is expected that these issues will be resolved using careful rheological and dispense control, tack-films, smart optical pattern-recognition targeting, and/or adaptive point-point interconnect. In fact, it is expected that the improved process will prove superior, in that perfect coplanarity and positioning may not be required, in all situations, given the adaptive capability of subsequent plate-up steps.

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	Isn’t this too “blue-sky”? Doesn’t the technology require lots of invention and discovery before it can achieve commercial reality?
	Are there other possibilities for interconnection of the components beyond those just mentioned?
	Can the technology accommodate present and future direct-write PWB concepts?
	Are materials available that are suitable for encapsulation? Have any materials been qualified?
	This seems like a very large and daunting task. Even if the industry accepts the ideas, won’t it take the industry a long time to adapt to this new way of manufacturing?
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