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How will the technology address the assembly of passives (chip-caps, chip resistors, MELFs, etc) and other packages, whose terminals are typically tin-lead solder-plated?

Answer: This is an important question and there is no definitive answer at this moment. While there in nothing intrinsic in solder that would inhibit a metal such as copper from being plated to tin, solder, whether tin-lead or lead free, is not plated to under normal circumstances. It is in fact very possible that the solder finish can be reliably activated and plated to but there is need to prove that such is the case. The most desirable finish for component package leads appears to be copper and this would obviate the need to overplate the leads thus avoiding that expense.

Pre-treatment could offer solutions and further development may be necessary. However, because the interconnections will be encapsulated and not be as highly stressed, as are traditional soldered components this may prove to be a non concern. As an option until there is certainly that there is need for a new finish and it is broadly instituted by discrete component suppliers, discrete devices can either be integrated into the assembly and soldered to a component or they can be assembled to a carrier using conductive adhesives and processed as a regular component. Since a significant number of circuit failures are related to discrete devices’ solder joints because of high temperatures, any of the methods described could significantly improve final yield.

It is expected that over time and initially in critical niches, a package supply segment will arise that will offer lower-cost copper end-terminations, optimum for the technology

Others in this Category

	Can the technology deal with misregistration, at placement and then during encapsulation should it occur?
	What can be said about reliability of these assemblies?
	Will the assemblies cost more?
	This seems like a very large and daunting task. Even if the industry accepts the ideas, won’t it take the industry a long time to adapt to this new way of manufacturing?
	Will multiple sources of the technology be available?
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