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Will this technology have an impact on electronic product design?

Answer: Yes. The solutions in development are expected to have a very positive effect on design, in that they have the ability to open routing channels and thus reduce layer count requirements. Moreover, the technology offers the designer the opportunity to completely ignore non functional lands, thus opening up additional circuit real estate to prospective additional use in routing or spacing circuits. New products will likely arise to take advantage of improved thermal management, embedded components, physical structures, topology, and mechanical-property options. Additional concepts are being collected and codified relative to design to allow for the creation of brick like assemblies that can be interconnected on all edges and both major surfaces. Moreover the concept extends to the creation interconnected brick like elements that are interlaced with cooling features that have not been available before. Design and EDA tool developers have been made aware of the opportunity and it is anticipated that they will begin to modify their tools to meet the slightly different needs of the new technology and make the designer’s job easier.

Others in this Category

	Will products built in this manner be Underwriters Laboratories (UL) certifiable?
	What can be said about reliability of these assemblies?
	Are there other possibilities for interconnection of the components beyond those just mentioned?
	Build-up technologies require very high yields at each step. Is the technology mature enough to risk entire assemblies?
	Can the technology accommodate very small geometries, such as with 0201 and 01005 discrete devices?
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