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Are materials available that are suitable for encapsulation? Have any materials been qualified?

Answer: Yes. Several off-the shelf materials appear suitable. Requirements for encapsulants include dimensional stability, resist excessive shrinkage resistance, good insulation, low moisture uptake and outgassing, and having a CTE approximating the CTE of common components (e.g., copper ~18ppm/°C), plus all the appropriate mechanical properties. Material developers have a good heritage of producing such products. It is anticipated that this target property balance will be feasible. Qualification depends on the application, but coatings and potting materials tailored for successful harsh MIL-aero and under-the-hood applications have been available for years. No problems are anticipated in finding and demonstrating suitable solutions.

Others in this Category

	Are there other possibilities for interconnection of the components beyond those just mentioned?
	How will the technology address the assembly of passives (chip-caps, chip resistors, MELFs, etc) and other packages, whose terminals are typically tin-lead solder-plated?
	What about connectors and sockets? Can they be added or connected to the assembly if needed?
	Will the assemblies cost more?
	Can the technology deal with misregistration, at placement and then during encapsulation should it occur?
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