Search: Advanced search

Build-up technologies require very high yields at each step. Is the technology mature enough to risk entire assemblies?

Answer: Yes. Build-up technology, used in substrate fabrication and the creation of high density interconnect (HDI) IC packages, is very mature. Moreover, some of the concepts being proposed for creating solderless electronic assemblies of tested and burned-in IC packages are used in the creation of IC packages themselves, plated contacts are made to terminals on the unprotected IC, which are often of unknown or uncertain quality. These IC package assemblies pass high temperature soldering requirements when soldered to the board. This provides heritage evidence that the the process, as applied to Level-2 assembly, should provide adequate reliability. With the new interconnection approach the yield should be equivalent to or even better than IC packaging yield, which is much better than solder joint yield. The feature sizes and material set and robustness of interconnection interfaces makes it possible to produce highly reliable products.

Others in this Category

	Are there other possibilities for interconnection of the components beyond those just mentioned?
	Have other solderless possibilities been explored?
	Is the technology appropriate for X-Ray inspection?
	Will the assemblies cost more?
	How will the technology address the assembly of passives (chip-caps, chip resistors, MELFs, etc) and other packages, whose terminals are typically tin-lead solder-plated?
	» More articles