Verdant Electronics is developing a new solder-free electronics assembly process tentatively being called the Occam Process in honor of the 14th century philosopher whose words inspired the concepts found herein. Products built by this process are expected to be more reliable than previous solder-free strategies (e.g., using conductive adhesive as a solder substitute) as well as traditionally manufactured soldered assemblies. The reverse order interconnection process embodies mature, low-risk, familiar core processing technologies in a novel sequence. Because components are interconnected by means of copper plating after they are assembled into their final positions in an encapsulated module, conventional circuit boards are not required. Prototype assemblies using this new technology are currently being characterized.

The process has demonstrated the conceptual potential for the manufacture of high-density, high-performance, high-reliability and environmentally (i.e., RoHS) compliant next-generation solutions for products ranging from consumer to mil-aero applications. Inherent in the concept is elimination of high-temperature exposure, tin whisker risk, and vulnerability to mechanical shock and thermal cycle fatigue failure. Other anticipated benefits include simplified design (tightened geometries for higher-density form factors), fewer processes (including elimination of all solder processing and associated issues), and diminished material costs and supply infrastructure.