Occam Webinar On-Demand

Listen to this presentation about the new, solder-free technology for PCBs and Assemblies
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Verdant Electronics is developing a new solder-free electronics assembly process tentatively being called the Occam Process in honor of the 14th century philosopher whose words inspired the concepts found herein. Products built by this process are expected to be more reliable than previous solder-free strategies (e.g., using conductive adhesive as a solder substitute) as well as traditionally manufactured soldered assemblies. The reverse order interconnection process embodies mature, low-risk, familiar core processing technologies in a novel sequence. Because components are interconnected by means of copper plating after they are assembled into their final positions in an encapsulated module, conventional circuit boards are not required. Prototype assemblies using this new technology are currently being characterized.

The process has demonstrated the conceptual potential for the manufacture of high-density, high-performance, high-reliability and environmentally (i.e., RoHS) compliant next-generation solutions for products ranging from consumer to mil-aero applications. Inherent in the concept is elimination of high-temperature exposure, tin whisker risk, and vulnerability to mechanical shock and thermal cycle fatigue failure. Other anticipated benefits include simplified design (tightened geometries for higher-density form factors), fewer processes (including elimination of all solder processing and associated issues), and diminished material costs and supply infrastructure.

"The Occam Process flips the problem to end the long tyranny of solder where modern solutions bring a plethora of problems. This novel �solderless� integrated interconnect system can deliver high values for density, performance, reliability, and robustness, but score a welcomed low for environmental impact. Occam goes beyond �out-of-the-box� thinking - it flips the box to empty extraneous parts, reinvents the PCB, and sheds the waste of conventional �components last� processing."
Ken Gilleo, PhD

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