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Paul Benke 
Paul Benke co-founded Zero Defects International and ZD Test, Inc. He has more than 25 years’ marketing, operations and executive management experience in the printed circuit board materials, fabrication and assembly industries. He was VP of Marketing and Sales for The Mica Corporation for 10 years. He then joined a start-up, Advanced Dielectrics, Inc., Fremont, CA (now Isola). As President of ADI, Mr. Benke had corporate responsibility for the technically sophisticated manufacture of laminates utilized to fabricate printed circuit boards. Under his direction, sales grew to almost $30 million within only six years, and profitability was well above industry standards, which positioned the company for acquisition. Benke has authored numerous technical and business articles for trade journals and is a credentialed community college instructor. He holds both BS and MBA degrees from California State University, Northridge.

Dr. Eric Bogatin
Dr. Eric Bogatin received his BS in physics from MIT and MS and PhD in physics from the University of Arizona in Tucson. He has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft, and Interconnect Devices. Dr. Eric Bogatin has written four books on signal integrity and interconnect design and over 200 papers. His latest book "Signal Integrity-Simplified" was published in 2003 by Prentice Hall. He has taught over 4,000 engineers in the last 20 years. Read his monthly signal integrity column "No Myths Allowed", in Printed Circuit Design and Manufacturing Magazine. He is currently President of Bogatin Enterprises, providing signal integrity content for print and online media. Through live classes and web based online lectures, Bogatin Enterprises and its web presence, www.BeTheSignal.com, is setting the standard in signal integrity training.


John Burke
John Burke founded the UK-based Surface Mounted and Related Technologies (SMART) Group in 1984, and has worked in the area of advanced manufacturing for many years. He has taught at various universities on technology, including the University of Dundee, University of Hull and University of Cambridge. Mr. Burke has been involved with the generation of IPC 1752 as a part of the 2-18 committees, dealing with reporting standards for hazardous materials. For many years, he been involved in the drive toward environmentally sound electronics assemblies, and has been heavily involved in trying to aid engineers caught up in the drive toward RoHS and JIG compliance. He is currently employed as Operations Director for a fabled semiconductor startup in the Silicon Valley.

MICHAEL CARANO
Michael Carano is vice-president of Electrochemicals, Inc., a developer and provider of processes and materials for the fabrication of printed wiring boards. He has been involved in the printed wiring board industry for over 28 years. His primary focus is on metallization technologies, electroplating, solderable finishes, HDI and imaging processes. He also looks for new ways to increase the competitiveness of the North American printed wiring board industry. Mike is also involved in strategic planning and technology roadmap formulation and implementation. Carano has published over 65 technical articles and has presented numerous other papers throughout the world. He is the holder of nine U.S. patents and over 20 foreign patents covering a variety of topics including plating, metallization processes and pwb fabrication techniques. He is the past chairman of the IPC Suppliers Management Council and currently serves on the IPC Long Range Planning committee. Michael is also a member of the IPC Board of Directors and is serving second term. He holds a Bachelor’s degree in Chemistry from Youngstown State University where he has also completed two years of graduate school in polymer chemistry and has earned an MBA in International Marketing from Baker College. ;

Tom Clifford
Mr. Clifford has a BS in Chemical Engineering, and has worked in plastics development (Monsanto), electronics (Raychem and Memorex) and the aerospace industries (McDonnell, UTC and Lockheed Martin) for the last 35 years. His duties (most recently) at Lockheed Martin / Sunnyvale included assembly supplier qualification, quality verification of PWBs and CCAs, SMT process development, and deployment of MEMS, microvia, CSP and other new technologies into advanced designs and processes. Recent projects include major thermal-cycle and vibe-shock reliability programs on array packages, embedded passives and CTE-matched substrates. Clifford holds several patents, including solder-joint reliability, and has authored many papers on thermal-cycle testing, SPC, DOE, PWB QC and reliability, embedded passives, life-test statistics, outsource management and more.

Gordon Davy
Gordon Davy has been involved with electronics design and manufacturing processes for over thirty years at what is now Northrop Grumman, a major defense electronics company. A major emphasis of his work has been soldering. He has published papers on assembly soldering, solder inspection and solderability, and has been a long-time participant in task groups developing and maintaining consensus industry standards on these topics. Dr. Davy has also been a regular contributor to the IPC Lead-free email forum since its inception in 1999 (in response to impending European legislation to prohibit the use of lead in electronic products). He received a PhD in physical chemistry from the University of California at Berkeley in 1970.

Werner Engelmaier
Werner Engelmaier has over 42 years’ experience in electronic packaging and interconnection technology. Known as ‘Mr. Reliability’ in the industry, he is the president of Engelmaier Associates, Inc., a firm providing consulting services on reliability, manufacturing and processing aspects of electronic packaging and interconnection technology. This consulting company provides services to OEMs, printed circuit board manufacturers, PWB subcontract assembly companies and such end users as telecommunications firms, computer companies and the military. Werner is sought out for his expertise in the areas of design for reliability, accelerated reliability testing, reliability prediction, design for manufacturability and quality, processing effects, and environmental stress screening for solder joints, plated-through holes, and dynamically used flexible circuitry. Prior to forming his own company in 1990, Mr. Engelmaier was on the technical staff of AT&T Bell Laboratories. During his 24 years at Bell Labs he dealt with many of the aspects involved in electronic packaging and interconnection technology. His efforts within the Bell System/AT&T ranged from R&D at Bell Labs to ‘fire-fighting’ at Western Electric. Mr. Engelmaier is the author of over 170 technical publications in a variety of fields related to Electronic Packaging and Interconnection Technology and has been awarded a number of patents in these areas. He has conducted numerous tutorial workshops at industry conferences.

Dan Feinberg
Dan Feinberg is President and CEO of Fein-Line Associates, Inc., a consulting firm focused on the electronic interconnect (printed wiring board) and assembly industries and a founding Partner in the Quantum Performance Group, LLC, a market research firm. Dan was formerly president of Morton Electronic Materials (MEM or Dynachem), a $220 million division of Morton International, Inc., and a group vice president of the parent company Morton International until its acquisition by Rohm and Haas in 1999.



Dennis Fritz
Dennis (“Denny”) Fritz started his career in the printed circuit industry in 1972 as a technical service representative with DuPont’s Riston™ division. He went on to hold many assignments in his 19 years’ direct employment at MacDermid, Inc., including sales and marketing management in both printed circuit consumables and semiconductor photoresist. Since April 1998, Mr. Fritz has been an independent technology consultant exclusively to MacDermid, and is the company’s principal representative to the U.S. Institute of Printed Circuits. He heads the Alternate Surface Finishes committee of IPC and is editor of the “Organic Board Fabrication” section of the 2007 IPC Roadmap. Fritz was the principal contact for MacDermid’s participation in the NIST Embedded Passives Program and is involved with market and technology research at MacDermid. He holds a BS degree in Chemical Engineering from Rose Hulman Institute of Technology and an MBA degree in Marketing from the University of Delaware. He works from his home in Brookville, Indiana.

Nader Gamini  
Mr. Gamini has over 22 years of experience in RF and optical package design, operations, quality/reliability, and production test. He is currently the VP of Manufacturing and a co-founder of Aeluros, Inc. Previously he was the Director of Advanced Packaging with Sirenza Inc., developing RF wireless and high-speed networking semiconductor products. His experience prior to Sirenza includes Director of Advanced Packaging with Rambus, and various managerial and engineering positions at Pacific Monolithics and Pantronix. A novel RF package, “PM-SOP”(TM), designed from the ground up by Mr. Gamini has been in high-volume production for over a decade. He serves as a member of technical advisory boards of several companies including Invensense (MEMS gyros) and VT Silicon (RF semiconductors). In addition to Aeluros, he serves on the board of directors of Verticle (high-brightness LEDs) and Celerity Research (smart probe cards). Mr. Gamini obtained his B.S. degree in Computer Science and holds 5 U.S. patents.

Dr. Ken Gilleo 
Dr. Ken Gilleo holds a PhD in Chemistry from the University of Connecticut (UCONN). He has developed new products for 35 years in circuitry, electronics materials, and packaging. He holds three dozen US patents and his products have won three R&D 100 Awards. An author of over 500 papers, presentations and workshops, Gilleo writes technical articles and columns for leading magazines. McGraw-Hill published his seventh book, MEMS and MOEMS Packaging. The latest book on forensic problem solving, The Day Niagara Falls Turned Green, is a free download at www.et-trends.com. CEO of ET-Trends, a consulting and Intellectual property firm focused on Emerging Technologies, Gilleo is an expert witness for patent litigation and technology-based cases. He is an active member of IEEE and IMAPS, and serves on the SMTA Board of Directors as Vice President of Technical Programs.

Steve Greathouse
Steve Greathouse (formerly of Intel Corp.) is President of “Greathouse Solutions,” a packaging and board assembly consultant group. Steve has managed and completed reliability testing on numerous programs including the development and deployment of PLCCs, PQFPs, known good die (KGD), Plastic BGAs, Tape BGAs, High Thermal laminate BGAs, uBGA™ along with other Chip Scale Packages (CSPs), and other leading edge packaging technologies including MEMS and Optical components. Steve has conducted dozens of electronic packaging conferences and seminars, and has published many articles on technical topics related to semiconductor packaging, lead free packaging, and is currently teaching classes on Pb-free board and component marking methodology for international markets. Steve is currently on the SMTA technical committee, the chairman of the SMTA Internet committee, and the Vice President of Communications on the board of directors of the International SMTA.

Dr. Belgacem Haba
Dr. Belgacem Haba joined Tessera in 1996 and is now a Tessera Fellow and CTO of Advanced Packaging and Interconnect. He is responsible for overseeing next-generation research and development activities for Tessera, Inc. Dr. Haba is also a co-founder of SiliconPipe, Inc., a high-speed interconnect start-up company based in Silicon Valley. Prior to that, he managed the advanced packaging research and development division at Rambus. From 1991 to 1996, he managed advanced research and development projects at the NEC Central Research Laboratories in Japan and, before that, worked for IBM at its T.J. Watson Research Center in New York. During his tenure at NEC and IBM, Dr. Haba’s activities included the applications of lasers in the field of microelectronics.


Martin Hart 
Martin Hart holds concurrent positions as CEO of startup Mirror Semiconductor as well as president of venerable TopLine Corporation with 15 years experience with PCB test vehicle design and chip packaging. Previously Mr. Hart was CEO of National Electronics Corporation, a distributor of components. He is co-inventor of Chip Packaging 2.0 and holds several patents in electronics packaging and production and graduated with a degree in Electrical Engineering from California State University, Long Beach.
http://www.MirrorSemi.com



Happy Holden
Happy Holden is the Senior PCB Technologist for Mentor Graphic’s System Design Division in Longmont, Colo. He is responsible for advanced and next-generation printed circuit technology consulting for Mentor’s customers and MGC engineering. Prior to joining Mentor, he was the Advanced Technology Manager at Westwood Associates and Merix Corporations. He retired from Hewlett-Packard after over 28 years. Mr. Holden formerly managed Hewlett-Packard's application organizations in Taiwan and Hong Kong. His prior assignment with HP had been as director of PCB R&D. He holds degrees in Chemical Engineering and Computer Science. He is a member of the IPC, SMTA, IMAPS and the IEEE.

Harvey Miller
As the creator of Fabfile Online, a proprietary database of the printed circuit fabrication industry, Mr. Miller analyzes interconnection and packaging from chip to box, assessing technology and business trends and impacts. His educational background includes a BS degree in Economics from the University of Michigan, Army Specialized Training in electrical engineering, and subsequent EE courses. He also spent 25 years as a component engineer for OEMs. Since 1975, Harvey has been an analyst and consultant.



Richard Otte
Mr. Otte has been the President & CEO of PROMEX INDUSTRIES INC since 1995. Prior to that he was the General Manager of AMP’s (now Tyco’s) Passive Fiber Optic Products Subsidiary in Palo Alto, CA. From 1987 to 1992, Mr. Otte was President of Advanced Packaging Systems, a Raychem business unit in San Jose, CA, that developed and sold microelectronic packaging solutions utilizing co-fired ceramic, thin film and planar optical waveguide technologies.




Dr. Alan Rae
Alan Rae has many years of experience in technology commercialization and international business. While with Cookson Group plc, he was instrumental in ensuring the success of startup and developed businesses, including structural ceramics, flame retardants, refractories, electronic ceramics and wafer plating systems. From 1999 to 2004, Dr. Rae was VP of Technology for Cookson Electronics, deeply involved in developing business opportunities for materials systems and equipment in silicon wafer fabrication, packaging, circuit board manufacture, circuit board assembly and recycling. He is Director of Research for iNEMI Inc. (the International Electronics Manufacturing Initiative), a member and past Chair of the JISSO North America Committee (facilitating electronics business worldwide by harmonizing technology roadmaps and standards), and a member of the Industrial Advisory Board of SMTA (the Surface Mount Technology Association). Rae is also a member of the ANSI-Accredited US TAG to ISO TC229 (Nanotechnologies). He holds a Bachelor's Degree from the University of Aberdeen and PhD and MBA degrees from the University of Newcastle upon Tyne. Rae is a member of the Royal Society of Chemistry and a Chartered Chemist.

Bernie Siegal
Bernie Siegal's first involvement in semiconductor thermal matters came in 1966 while working at Hewlett-Packard Associates (HPA), the microwave semiconductor group within HP. He and an associate developed a automated system for making thermal resistance measurements on microwave diodes and authored the feature article describing the method that appeared in the October 1967 issue of the HP Journal. From that beginning to today, Bernie has been an active participant in the semiconductor thermal measurement, modeling and management field.



Vern Solberg
Vern Solberg has served the industry for more than twenty-five years in areas related to design and manufacturing for both commercial and aerospace electronic products. For ten years, he was associated with Tessera as its Senior Applications Engineer. (Tessera is the San Jose-based developer of the µBGA, a die-size IC package and the µZ family of 3D package technologies.) Mr. Solberg is active as an educator and holds several patents for IC packaging innovations including the folded-flex 3D package technology. He is also the author of Design Guidelines for Surface Mount and Fine-Pitch Technology, a McGraw-Hill publication. Solberg currently contributes his expertise to several industry organizations, including IPC, SMTA, IMAPS and he is a US delegate to the JISSO International Council (JIC).

Tony Vacca
Since 1998, Mr. Vacca has been an independent consultant, serving such clients as Cray Inc., SRC Computer Inc., Target Management, and MCNC. From 1996 to 1998, he was Sr. Director of Technology Development at Silicon Graphics Inc. In this role, studies of emerging hardware (packaging, PC Board, interconnect and thermal control) technologies as they applied to advanced high-performance computer systems were developed with the industry and various research agencies and universities. Vacca has also worked with partnerships established with government (DARPA and DOD) funding.

Henry Utsunomiya
Henry Utsunomiya is a globally recognized authority in high technology with experience in compound semiconductor wafer technology marketing as well as expertise in PBGA, MCM-L and other IC packaging substrate technologies. His very active 25 year career includes more than 10 years of involvement and experience in international electronics / semiconductor standards and forecasting committee activity with such industry association as IPC, SIA, EIAJ and JIEP. Mr. Utsunomiya is licensed by the Japanese Government as a small and medium enterprise business consultant and has continued in this activity since early 1999. He is also a member of the Jisso International Council and ITRS Roadmap committee and has been a key contributor to the Jisso Roadmap published by the EIAJ and JEITA since its first printing. His important contributions to the electronics industry have been recognized as he is a recipient of the IPC President’s Award.



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